A SURVEY AND TUTORIAL OF DIELECTRIC （一项调查和电介质的教程）.pdf

A SURVEY AND TUTORIAL OF DIELECTRIC MATERIALS USED IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS. By Lee W. Ritchey, Speeding Edge, for publication in November 1999 issue of Circuitree magazine. Copyright held by Lee Ritchey of speeding edge, September 1999. Introduction This article was written in response to numerous requests for help selecting the best dielectric for a particular printed circuit board design. The task has always been clouded by a confusing array of materials choices, equally confusing claims by the manufacturers of those materials, confusion about what the actual requirements of an application are and a substantial collection of misinformation circulating in the design and fabrication communities. The goal of material selection should be to choose a material that adequately handles the signaling task and, at the same time, achieves the lowest overall PCB cost. This task has been further complicated in recent years by the increasing clock frequencies of PCs and by the drive for gigabit and beyond data rates in ethernet related products. Questions arise almost daily about whether FR-4 based materials are capable of serving in these applications. Recent studies that shed some light on this question will be shared in this article. Two major applications areas, RF/analog and Digital Electronic packaging can be divided into two major applications areas, each of which has its unique requirements. The requirements are sufficiently different that two classes of materials have been developed to meet their needs. Understanding these areas and their requirements are basic to making the correct material choice. The two major applications areas are RF/analog and digital. The major differences between these two areas are the ability of the circuitry involved to tolerate signal losses and the complexity of the circuitry. RF/Analog Circuit Characteristics RF/analog circuits are