Introduction Discussion - Barry Ind（介绍讨论巴里）.pdfVIP

Title: Document No.: Revision: Recommended Soldering Techniques when CT-SOL-1 - Soldering to CT Metallization Scheme Introduction Barry Industries products with a “CT” metallization scheme are widely used in customer applications that require solder mounting. This application note addresses the requirements for soldering to achieve the specified performance. Discussion The Barry Industries product line of chips and devices utilizing our “CT” metallization scheme was developed to be solder mounted. When properly soldered, the customer will realize consistent, reliable performance. Proper soldering technique is paramount to the reliability. Barry Industries has designed their devices to be soldered in accordance with the Industry Standard IPC-A-610. This standard is quite extensive and is available for purchase at , but for the purposes of this discussion, a few of the key elements will be highlighted. IPC-A-610 defines an acceptable solder joint to have the following characteristics. - A solder fillet will appear generally smooth and exhibits good wetting of the solder to the parts being joined - The outline of the parts being soldered is easily determined - Solder at the joint creates a feathered or blended edge - Fillet is either concave in shape or has a wetting angle not exceeding 90 degrees. The figure below illustrates the definition of the wetting angle as specified in IPC-A-610. Author:P. Booth Date:22 June 2007 Title: Document No.: Revision: Recommended Soldering Techniques when CT-SOL-1