Preparation of Metal Substrates for Bonding （制备的金属基板焊接）.pdfVIP

LORD Adhesives LORD APPLICATION GUIDE Page 1 of 4 Preparation of Metal Substrates for Bonding with ® LORD Adhesives One of the most important factors infl uencing adhesion • Abrading – A wire brush or abrasive paper is used in the bonding process is surface preparation. To ensure to grind the surface. Care must be taken to prevent optimum bond performance and long-term environmental contamination of the abrasive material and to remove resistance, metal substrates must be free of organic dust and particles after use. and inorganic contaminants. Organic materials include • Machining – If cutting oils are completely removed, grease, dirt and oils which can be removed by solvent or machining provides an acceptable bonding surface. alkaline cleaning. Common inorganic contaminants are However, any oil/grease left on the metal surface will rust, scale and oxide layers. These can be cleaned by reduce adhesion. either mechanical or chemical processes, or a combina- Chemical processes, on the other hand, utilize organic tion of both. and inorganic chemicals to achieve two reactions: Regardless of which method you choose, the essentials • Dissolve, suspend or eliminate soils and surface of all good surface preparations include: contaminants. • Removal of all surface contaminants and • Convert metal surfaces from the essentially free decomposable products. metallic state into metallic compounds. • Prevention of recontamination. • Careful handling through all processing steps. Selecting a Preparation Method