Process capability factors in microhole drilling （微孔钻井过程能力因素）.pdfVIP

Process capability factors in micro-hole drilling of BGA board materials By Tony Bannan, Chris Gerrard, Mike Wellstead This paper was presented at the EIPC Winter Conference, Budapest, 26-27 January 2006 High levels of machine and process capability are demanded to ensure manufacturing productivity in BGA and CSP-type circuit systems. The factors determining capability include drilling machine axis control, configuration of the cutting tool and gripping arrangement, integrity of work holding and precision of drilling spindle. The contribution of these elements is analyzed and reported. 1 Introduction The drilling spindle used in the PCB drilling machine is a high-precision motorised-bearing unit with one primary, essential function: to rotate the drill-bit as accurately as possible, with respect to both speed and geometric uniformity, in order to drill the required hole as productively and as precisely as possible. Due to the speed ranges required, most modern PCB drilling systems utilise air bearings, allowing for very low friction, high stiffness and low geometric runout. Speed and torque control are essential to enable a range of drill sizes to be used effectively. A brief description of the air- bearing spindle is provided in section 2. PCB drillers and OEMs utilise a wide range of techniques to quantify hole registration accuracy and a common statistical control method used is the calculation of the process capability, commonly referred to as C . Since it is relevant to the context of this paper, a pk short recap of process control principles is given in section 3. Process capability is a critical validation measure and is often used by OEMs and PCB drillers alike to quali