贴片电容焊接.PDF

. 贴片电容焊接贴片电容焊接 、储 方法 Storage Methods 确保芯片可焊性良好的贮存期限为6 个月( 包装好已交付的情况下) 。 The guaranteed period for solderability is 6 months (Under deliver package condition). 储存条件/Storage conditions ： 储存温度/Temperature 5~40 ℃ 储存相对湿度/Relative Humidity 20~70% 使用前的注意事项 Precautions For Use 多层片式瓷介电容器(MLCC) 短路或开路的电路中都有可能失效,在超出本承认书或相关说明书中所述 使用频率的恶劣工作环境,或外界机械力超压作用下, 电容芯片都有可能着火、燃烧甚至爆炸,所以 使用的时候, 首先应考虑按本承认书的有关说明来进行,如有不明之处,请联系我们技术部、品管部或生产部. The Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit modern in an open circuit mode when subj ected to severe conditions of electrical environment and / or mechanical stress beyond the specified “rating” and specified “conditions” in the specification, which will result in burn out, flaming or glowing in the worst case. Following “precautions for “safety” and Application Notes shall be taken in your maj or consideration. If you have a question about the precautions for handling, please contact our engineering section or factory. 1. 焊接的条件与相关图表 Soldering Profile 为避免因温度的突然变化而引起的芯片开裂或局部爆炸的现象发生,请按有关温度曲线图表来进行.(请参 考附页中的图表) To avoid the crack problem by sudden temperature change, follow the temperature profile in the adj acent graph (refer to the graph in the enclosure page). 2. 手工焊接 Manual Soldering 手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部爆炸的现象, 焊接时,如果操作者不小 心,会使烙铁头直接同电容芯片的瓷体部分接触,这样很容易使电容芯片因热冲击而受损或出现其他意外. 因此,使用电烙铁手工焊接时应仔细操作,并对电烙铁的尖端的选择和尖端温度控制应多加小心. Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator s careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of th