BGAVoid气泡问题分析概要.ppt

* * * * * * * * Sources of Voids Sources of Voids N2(g) Chamber2 Pressure=P2 P1P2 LN2 N2(g) Chamber1 Pressure=P1 Molten solder 在锡球生产过程中,会使用两个压力不同的Chamber,上方镕解槽C的压力大于下方冷却槽,并借着压力差使镕融的锡从Chamber 1被挤压到Chamber 2滴落,并在Chamber 2冷却成形 在溶融的锡中,所有的气泡都会因为浮力而悬浮在镕融的表面上,所以在溶融液中是没有气泡的 镕融且未含气泡的锡在冷却阶段随着时间变成球形 锡球生产的方式 Sources of Voids Package side Flux Package side Package side Package side Package side Board side Paste Board side Board side Package side Bubble Package side 芯片植球的过程 芯片Mount在主板上的过程 有机会消散掉 三明治结构让气泡无法散去 Sources of Voids ? Shrinkage– the interior of a solder joint is the last part of the joint to solidify so you expect it to have a void. ? Moisture and contaminates supply gases that can be trapped. ? Flux in the paste degrades and becomes gaseous during ramp-up in the reflow oven. On a BGA the gases are tightly sandwiched between two surfaces and the voids that occur typically rise to the top of the solder joint. A high ramp rate can cause more voiding by not allowing time for void migration out of the joint (ramp rate example, 75 vs. 60°C/minute) ? Paste flux to attach PBGAs tends to produce fewer voids than with solder paste. ? Too much flux added during the rework process can cause voids. ? Proper oven profile and clean parts can reduce solder voids 锡球内的气泡通常导因于锡球陷缩,湿气与锡膏挥发物 陷缩:通常,锡球的内部是在整个焊点的固化过程中最后冷却凝固的部份,可以预期这样的现象会导致陷缩孔产生 湿气跟污染物在挥发时被锡球捕捉而形成锡球内气孔 锡膏内的助焊剂在回焊炉升温的过程中因为降解而呈现汽化的状态.而在BGA中,挥发的气体将被紧包在像三明治一样的两层PCB板间,而产生的气泡也通常会上升到锡球的上方.通常一个比较快速的升温曲线会使锡球内产生更多的气泡,因为没有足够的时间让气泡可以移动到锡球表面消散掉 PBGA所使用的助焊膏比锡球用的助焊剂较不易产生气泡 在维修过程中所加入的过多助焊剂会导致锡球产生气泡 合适的炉温及干净的零件会降低锡球产生气泡 Sources of Voids: Especially for ImAg Board Galvanic Corrosion:电镀锈蚀腐蚀 当两种不同的金属直接接触并曝露在水或含融盐的水等电解质中，会产生电镀锈蚀腐蚀。电流会在两种金属之间流动，类似电池的化学反应因而产生。两种金属之间的电位差越大，氧化的速度越快；反之，电位差越小，氧化的速度越慢。而铜与银之间的电位差使得铜箔表面出现陷穴 Sources of Voids: Especially for ImAg Board Immersion Ag Cu cave Flux IMC IMC IMC 铜箔中的陷穴,导致了气泡的生成 IPC-7095B对锡球的描述 Type A: Void(s) within the ball (package level) as received. Type B: Void(s) at the ball/package substrate interface as