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pcb制造大揭密(PCB revealed)
pcb制造大揭密(PCB revealed)
PCB revealed
First of all: what is the raw material of PCB (printed circuit board)? We know there is something called glass, this kind of material in our daily life. Obviously, such as core fireproof cloth, fireproof felt is glass fiber, glass fiber and resin is easy to combine, we put into the tree structure of glass fiber cloth and high strength grease, hardening has heat insulation PCB, not easy to bend the substrate -- if the PCB board is broken, white edge delamination, enough to prove that the material is glass fiber resin. So what? We cant transmit electrical signals just as insulation plates, so we need to cover the surface with copper. So we call the PCB board a copper clad substrate. In the factory, the common copper substrate code is FR-4 (but not F4: ah, the manufacturers in the board) which in general there is no difference, so we can think of everyone at the same starting line, of course, if it is best to use high frequency board, copper clad PTFE glass cloth laminate high cost.
Copper cladding process is very simple, generally can be made by rolling and electrolysis method, the so-called calendering is the Gao Chundu (99.98%)
The copper rolling method on the PCB substrate, because the adhesive has excellent epoxy resin and copper foil, copper foil adhesive strength and high working temperature, can be no bubble dip in 260 DEG C in molten tin. This process is like rolling dumpling wrappers, but the dumpling wrappers are thin and thin. The thinnest is less than 1mil (industrial unit: mil, 1/1000 inches, equivalent to 0.0254mm)! If the dumpling wrappers are so thin, the pot must leak! The so-called electrolytic copper in junior high school chemistry has learned, CuSo4 electrolyte can continuously manufacture a layer of copper foil, this is more easy to control the thickness, the longer the copper foil the more thick! Usually the factory has strict requirements on the thickness of copper foil, usually between 0.3mil and 3mil, and ha
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