再流焊（Reflow soldering）.doc

再流焊（Reflow soldering） Reflow soldering The reflow process overview Reflow (Re-flow Soldering), also called reflow, is with the miniaturization of electronic products and the development of soldering technology is mainly used in all kinds of welding, surface mount components. The solder for this welding technique is solder paste. Proper and appropriate forms of solder paste cast in the welding position of the printed circuit board in advance, and then placed in surface mount components, solder paste viscosity components on the PCB board, heated by an external heat source, the solder melting and infiltration will flow again, components soldered to the printed circuit board. Reflow soldering method of operation is simple, high efficiency, good quality, good consistency, save the solder (a very thin layer of solder only in the components of the pin down), is a kind of electronic product assembly technology is suitable for automatic production. Reflow soldering technology has become the mainstream of SMT circuit board installation technology. The general process flow of reflow soldering technique is shown in figure 5.52. 5.33 reflow process general process The characteristics and requirements of reflow soldering. Compared with wave soldering technology, reflow soldering process has the following technical characteristics: The element is not directly impregnated in the molten solder, so the component receives less thermal shock (as the heating method is different, and in some cases the thermal stress applied to the component is greater). And can be applied in the leading process in controlling the amount of solder, reducing the weld welding defects, bridging, and good welding quality, high reliability. If the leading process on PCB cast solder components placed in correct position and position has certain deviation in the reflow process, when all the welding components, and the corresponding end pin pads and infiltration, due to the surface tension of molten solder, produ