电镀五)（Plating five)）.docVIP

电镀五)（Plating five)） Dip plating, foaming, causes and Countermeasures of lack of peel strength Time: 2009-02-26 14:36 source: PCBBBS China Forum Network Click: 95 times print recommended wrong comments Production line bad, plating, delamination, blistering, an important reason for problems such as lack of peel strength even in processing part. Including dry film, solder pretreatment, pre plating treatment multi section part The production process of PCB rigid pcb and FPC soft circuit board will often encounter the following problems: A section of line, processing of dry film or wet film after etching lines appear side corrosion, pitting phenomenon, resulting in inadequate or uneven. The line width of the reason more dry film and improper material selection, improper exposure parameters, exposure machine performance is poor. The developing, etching period of nozzle adjusting related parameters, adjustment reasonable, the concentration range of improper driving speed may lead to improper series problems. However, we often find that after checking the above parameters and related equipment performance and there is no exception, but in plate still appears to pass line corrosion, pitting and other problems. What is the reason? In two, PCB PCB, FPC terminal pattern plating, surface treatment such as gold, gold, electric tin, tin and so on process. We often find out in wet and dry film edge or solder plating layer edge phenomenon, or most board, in part or portion of the plate the party, no matter what kind of situation will cause unnecessary or undesirable for scrap after section processing to bring unnecessary trouble, and eventually scrapped, heartache! Analysis of the reason we usually think of is dry and wet film parameters, the problems such as hard material properties; resistance welding with ink, coating with soft board has a problem, or pressing in printing, curing, etc. section there is a problem. Indeed, these places everywhere may cause this problem so. We are a