abs装饰性电镀应用培训资料1.pptVIP

* * Udique? 887 DT Accelerator is a fluoride based process, therefore, titanium heating coils cannot be used. Heating coils must be of Teflon spaghetti design. Teflon coated titanium heating coils usually get destroyed at some point due to pin-holes in the Teflon coating or gouges created during installation or use. * Filtration required using 5-10 micron cotton or Dynel wound polypropylene lined filter tubes or equivalent. Filtration rate of 1 to 2 turnovers per hour. Excessive solution movement can contribute to skip-plating. Return flow of the filtered EN solution to the plating bath must be properly directed and controlled to eliminated plating rejects due to either excessive or inadequate solution movement. UDIQUE? 891/894 contain the same amount of metallic stabilizer UDIQUE? 543 can be used to supplement the metallic stabilizer UDIQUE? 893 can be used to supplement the chelators * Low UDIQUE? 892 concentrations will cause a slow plating rate, slow initiation rate, and/or promote skip plate. High UDIQUE? 892 concentrations will increase plating rate, initiation rate and phosphorous content in the deposit * Low concentration will increase contact burn-off, initiation rate and plating rate Will promote nickel dissolution/attack in the copper strike May cause gas pitting High concentration will slow initiation rate and plating rate Low metal thickness Will contribute to skip-plating Will promote nickel dissolution/attack in the copper strike * * * * * 8ml 63 8ml 61D 2ml * 2.5 μm DUR-NITM 15 μm Bright-nickel 0.25 μm Chrome Distribution of Pores Semi-bright-nickel Bright-nickel DUR-NITM STEP TEST 200 250 300 350 400 450 500 0 5 10 15 20 25 30 35 40 Thickness [?m] E [mV] 镀铬及铬活化剂 铬活化剂 乐思工艺---ANKOR NFDS 时间---30秒 使用这些溶液的目的是清除镍氧化物，使镍层具有活性可以进行镀铬 光亮镀铬 乐思工艺--- ANKOR 1120H 时间—3 – 4 min 厚度0.18 um 漏镀 粗化浓度、时间或温度太低 粗化三价铬浓度太高 塑料应力太高 钯活化剂浓度、时间或温度太低 解胶浓度、时间或温度太低 解胶空气搅拌太强 化学镍温度太低 挂具将粗化液带进其它镀液 化学镍Udique 892浓度太低 化学镍pH太高 绝缘油太多，带进槽液 粗化表面太张力太高 化学镍镀层粗糙 前处理过滤不良 水洗槽太脏 化学镍温度