PCB英文培训教材.docVIP

PCB英语培训资料 一. 流程英语及相关词汇 PCB(Printed Circuit Board) 印制线路板 Marketing Department市场部 PE – Product Engineering Department 产品工程部 MI - Manufacturing Instruction生产制作指示/生产流程单 CAD/CAM - Computer Aided Design计算机辅助设计/制造 TQ—Engineering Technical Query 工程问题 1. Inner board cutting: 内层开料-1 Sheet Size大料尺寸 Panel Size拼板尺寸 Material Type材料类型 Supplier供应商 Base material基材 Thickness厚度 Board Thickness板厚 Laminate Thickness材料厚度 inner core 芯板/内层板料 Comparative Tracking Index 比较漏电痕迹指数CTI Glass Transition Temperature玻璃态转化温度 Tg 1. Inner board cutting: 内层开料-2 Dielectric Thickness介电层厚度 Dielectric constant介电常数 Er Base Copper底铜/基铜 Delamination分层 Flammability可燃性 Baking烘板 Single/double单层/双面 Double sided board双面板 Multilayer board 多层板 Bare board裸板 (board without copper) 2. Inner Image Transfer:　内层图像转移/内光成像3. Inner Etching 内层蚀板4. Inner AOI—Automatic Optical Inspection自动光学检查5. Pressing 层压 Lamination 压板 Lay-up structure压板结构 PP - Prepreg半固化片 Copper clad/ Copper foil铜箔 Cu foil Resin树脂 After Pressed Thickness压板后之厚度 6. Drilling 钻孔-1 Hole孔 Hole Type孔类型 Hole Tolerance 孔径公差 Hole chart 孔表/分孔图 Plated Though Hole 金属化孔PTH Non-Plated Though Hole 非金属化孔NPTH Drill tape钻? 带 Blind via hole盲孔 Buried hole埋孔 Hole Diameter孔径 6. Drilling 钻孔-2 Hole location孔位 Hole Position Tolerance孔位误差 Hole Position Deviation 孔位置偏差 2nd Drilling 重钻 Mounting hole安装孔 Pin hole销定孔 Target Hole目标孔 Slot 槽,坑 No. of holes孔数 Laser via hole激光穿孔 Roughness粗糙度 7. Plate Through Hole (PTH)沉铜/孔化 Hole wall copper thick 孔壁铜厚 Defect缺陷 Cracking裂缝 8. Outer Dry Film 外层干菲林/外光成像 -1 Dry Film干菲林/干膜 D/F External layer外层 Internal layer内层 Component Side 零件面 C/S Solder Side焊接面 S/S Top side/ layer 顶层 Bottom side/layer底层 Primary side首面 Secondary side第二面 (提示: 层的写法尽量按客户的习惯书写) 8. Outer Dry Film 外光成像-2 Power plane电源层 Ground 接地层 Layer层 Dry-film tenting D/F封孔 Surface mounting Device表面粘贴装置SMD Line Width线宽—LW Line Space线隙—LS: Line-Line/Line-Pad/Pad-Pad Conductor导体 Circuit线路 Pattern线路 Artwork菲林 Master drawing菲林图形 Artwork Modification菲林修改 Outer Dry Film外光成像-3 Annular ring锡圈 Min