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zb6（zb6） Basic knowledge of SMT technology The characteristics of the SMT 1. high density assembly, electronic products, small volume and light weight, volume and weight of SMD components only traditional cartridge elements around 1/10, common SMT, electronic products size 40%~60%, weight 60%~80%. 2. high reliability and strong vibration resistance. Solder joint defect rate is low. 3. high frequency characteristics. Electromagnetic and radio interference reduction. 4., it is easy to realize automation and improve production efficiency. Cost down to 30%~50%. Save material, energy, equipment, manpower, time, etc.. Why the surface mount technology (SMT)? 1. pursuit of electronic products miniaturization, previously used perforated insert element has been unable to reduce the 2. electronic products function more complete, the integrated circuit (IC) has no perforation elements, especially large-scale, highly integrated IC, have to use the surface patch element 3. batch, production automation, low cost and high yield to the factory development, to produce high-quality products to meet customer needs and strengthen the market competitiveness of the 4. electronic components, integrated circuits (IC) in the development of semiconductor materials multiple application of 5. electronic technology revolution is imperative, after the international trends Return Why the surface mount technology (SMT)? 1. pursuit of electronic products miniaturization, previously used perforated insert element has been unable to reduce the 2. electronic products function more complete, the integrated circuit (IC) has no perforation elements, especially large-scale, highly integrated IC, have to use the surface patch element 3. batch, production automation, low cost and high yield to the factory development, to produce high-quality products to meet customer needs and strengthen the market competitiveness of the 4. electronic components, integrated circuits (IC) in the development of semiconductor m