用于改善多指sigehbt热特性的变指间距设计方法研究-电子器件.pdfVIP

第34 卷 第4 期 电 子 器 件 Vol.34摇 No.4 2011年8 月 ChineseJournal of Electron Devices Aug. 2011 A Novel Method of Emitter Finger Spacing Design to Improve Thermal Characteristic of Multi鄄Finger SiGe HBT* * XIAO Ying,ZHANG Wanrong ,JIN Dongyue,CHEN Liang,WANGRenqing,DING Chunbao (School of Electronic Information and Control Engineering,Beijing University of Technology,Beijing 100124,China) Abstract:Thethermalresistancemodelof multi鄄finger HeterojunctionBipolarTransistor(HBT)isestablishedby in鄄 troducing coupling thermal resistance which represents thermal interaction among fingers.Based on the model,the dependence of coupling thermal resistance on finger spacing is obtained,which is used to obtain a set of unequal value finger spacings.When coupling thermal resistance profile is uniform,there is a set of finger spacing values which are coorespodingly in need of the temperature uniform distribution for HBT.The thermal resistance profile obtained by this method is in agreement with temperature distribution from thermal simulation method. But,this method avoids repeated thermal simulation to obtain a set of finger spacings for uniform temperature distribution of HBT,which is more fast and much easier to be observed.It provides convenience for finger spacing design. Key words:SiGe HBT;emitter finger spacing design;thermal resistance;thermal coupling EEACC:2560J摇 摇 摇 摇 doi:10.3969/j.issn.1005-9490.2011.04.006 用于改善多指SiGe HBT热特性的变指间距设计方法研究* * 肖摇 盈,张万荣 ,金冬月,陈摇 亮,王任卿,丁春宝 (北京工业大学 电子信息与控制工程学院,北京 100124) 摘摇 要:通过引入表示发射指之间热耦合程度的耦合热阻,建立了多指异质结双极晶体管(HBT)热阻模型。 基于该模型,得 到了耦合热阻与指间距的变化关系,并用于器件指间距的设计。 当耦合热阻均匀分布时,所对应的一套非等值的指间距值便 是器件温度均匀分布所要求的指间距值。 用该方法得到热阻分布与热模拟得到的温度分布相吻合。 但这种方法不必通过热 模拟来得到温度分布均匀的SiGe HBT各指间距值,具有快速、直观的优点,为变指间距的设计提供了