Wire Encapsulation Polysciences（线封装Polysciences）.pdfVIP

THE SEMICONDUCTOR INDUSTRY’S TECHNICAL AUTHORITY™ Vol. 27, No. 11 October 2004 Wire Encapsulation Improves Fine-Pitch Device Yield Laurie Roth, or years, flip-chip packaging technology throughput, with raw wire cycle speeds of more than Kulicke Soffa, has been touted as the replacement for 16 wires per second. This capacity