ipc印电路板.doc

印 制 电 路 板（Printed Circuit Boards） ? IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册 IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求 IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除 IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则 IPC-D-326A Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies印制板制造和其它电子组装的信息要求规范 IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 IPC-6012B Qualification and Performance Specification for Rigid Printed Boards刚性板的合格和性能规范要求 IPC-6015 Qualification Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 IPC-6016 Qualification Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-A-600G Acceptability of Printed Boards 印制板验收条件 IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价 IPC-PWB-EVAL-CH Printed Circuit Board Defect Evaluation Chart印制板缺陷评估图表 IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范 IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能 IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范 IPC-TR-481 Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果 IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价 IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验 IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范 IPC-DR-572