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主板制造流程(Motherboard manufacturing process)
主板制造流程(Motherboard manufacturing process)
According to the order of manufacture, the production of the main board can be divided into four processes.
I. R D process
The entire R D process basically in accordance with 4 major aspects, the 4 aspects are documents, PCB, testing and production. Because all links are closely linked, we will each step to detailing the motherboard R D.
First of all, through the introduction of Chipset characteristics, feasibility study of the project, if adopted, start the project. With the chip characteristics, you can prepare the first version of the motherboard specifications, and then follow the specifications to do schematic. Then calculate the approximate price and the BOM list (material list) according to the schematic and size, and start the wiring at the same time. After completion of the wiring, send out the film (the film of the film), make the PCB model, and then go to the factory to make the first manual sample. After the test of the engineering sample, if there is any problem, then hand it to the wiring Engineer for improvement, then release the second edition film and make the second PCB model. Then test again until normal work. After testing, the final PCB film and PCB will be formed. The PCB can be used in some future production and inspection fixtures as well as steel mesh. If you want to make the motherboard have its own characteristics, then in the wiring at the same time, BIOS should also edit the work.
In the whole process, the specification of the motherboard specifications is very important, it is like a Lighthouse, for future wiring engineers pointed out the direction of work. And wiring this step is the most important time in the entire motherboard research and development, but also the most exquisite place. The quality of the wiring has a direct impact on the price of the motherboard, stability and reliability of the work, and whether it can be tested by electromagnetic compatibility and so on.
Two 、 productio
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