原创力文档challenges in the assembly and handling of thin film capped mems devices挑战了mems薄膜设备的组装和处理.pdfVIP
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challenges in the assembly and handling of thin film capped mems devices挑战了mems薄膜设备的组装和处理
Sensors 2010, 10, 3989-4001; doi:10.3390/s100403989
OPEN ACCESS
sensors
ISSN 1424-8220
/journal/sensors
Review
Challenges in the Assembly and Handling of Thin Film Capped
MEMS Devices
Jeroen J. M. Zaal *, Willem D. van Driel and G.Q. Z
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