【2017年整理】IMC生长对无铅焊球可靠性的影响.pdfVIP

Technology Column IMC 沈萌, 华彤, 邵丙铣, 王 ( 复旦大学 材料科学系, 上海200433) : 通过模拟及实验研究了IMC 层及其生长对无铅焊点可靠性的影响采用回流焊将无 铅焊球 (Sn Ag Cu) 焊 到PCB板的铜焊盘上, 通过- 55~ 125 的热循环实验, 获得了IMC 35 07 厚度经不同热循环次数后的生长规律采用有限元法模拟了热循环过程中IMC厚度生长对无铅 BGA 焊点中应力变化的影响, 并由能量疲劳模型预测了无铅焊点寿命计算结果显示, 考虑 IMC 层生长所预测的焊点热疲劳寿命比不考虑IMC层生长时缩短约30% : SnAgCu无铅焊料; 电子封装; 金属间化合物生长; 有限元模拟 : TN30594 TN306 : A : 1003353X (2007) Influence of IMC Growth on Reliability of LeadFree Solder Balls S EN Meng, UA Tong, S AO Bingxian, WANG Jun ( Dep artment of Material Science , Fudan University, Shanghai 200433, China) Abstract: The influence of IMC growth on the reliability of leadfree solder joints was studied by simulations and experiments. The leadfree solder balls (Sn Ag Cu) were connected to the Cu plates on 35 07 PCBby solder reflow. The samples underwent thermal cycling at - 55 to 125 . The IMC thicknesses in solder joints subjected to different thermal cycles were measured. Finite element analysis was carried out to study the mechanical performance of leadfree solder balls by accounting the influence of IMC layer s growth. Furthermore, the solder joint lifetime was predicted based on the energy fatigue model and the simulations. The results show that the predicted lifetimewith IMC growth is 30% shorter than that without IMC growth. Key words: SnAgCu leadfree solder; electronic packaging; IMCgrowth; finite element simulation BGA , J LPang 1 引言