外层前处理案例解析 analysis of cases in outer-layer pretreatment process.pdfVIP

印制电路信息 2013 No.10 短评与介绍 Short Comment Introduction Imaging 图形转移 外层前处理案例解析 刘师锋 张长明 郭荣青 （胜宏科技（惠州）股份有限公司，广东 惠州 516211） 摘 要 电路板高密度化倾向，使得细、密线路板成为业界广泛的发展方向，而线路等级75μm/ 75 m甚至更细密之线路板，已在多家PCB制造商批量生产。然而，由于外层前处理参 μ 数、方法、物料管控不当产生的外层良率降低及报废飙升，令众多业者痛心疾首，望 板兴叹。本文通过对与外层前处理相关的案例进行解析及探讨，希望为同行业者带来 有参考价值的资料。 关键词 印制电路板；细密线路；外层良率；渗镀；铜丝 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2013）10-0029-04 Analysis of Cases in Outer-layer Pretreatment Process LIU Shi-feng ZHANG Chang-ming GUO Rong-qing Abstract High-density tendency of printed circuit boards has made the boards with finer and denser circuits widely-accepted in the industry. Boards with line width and spacing of 75 μm / 75 μm or even smaller than that, have been massively produced in many PCB manufacturers. However, the decreasing of out-layer yield and the soaring of scrap rate due to the improper controlling of the parameters, methods and materials in out-layer pretreatment process, has frustrated many manufacturers. This paper, through the analysis and discussion of the cases related to the out-layer pretreatment, is intended to bring the manufacturers with useful information for their reference. Key words PCB; Fine and Dense Line; Outer Layer Yield; Diffusion Coating; Copper Wire 1 引言 微蚀及电化学等方式进行，采用的原则会因铜面的 形式及所需的表面状态而决定，但粗化效果不佳时 （1 ）随着PCB 产业的高密度、精致化的发展