中国集成电路设计业2015年度会暨.docxVIP

中国集成电路设计业2015年会暨天津集成电路产业创新发展高峰论坛CSIA-ICCAD 2015 Annual Conference Tianjin IC Industry Innovation and Development Summit会议日程Agenda?2015年12月10日，星期四December 10, Thursday, 2015地点：天津梅江会展中心一楼N4多功能厅Venue:?Multiple-function hall N4, 1/F,?Tianjin Meijiang?Convention??Exhibition Center时??间Time内????????容Contents开?幕?式Opening Ceremony主持人：天津市科委Moderator:08:30-08:55天津市政府领导致开幕词Address, Tianjin Municipal Government中国半导体行业协会执行副理事长徐小田先生致词Mr. Xu Xiaotian, Executive Vice General Director, CSIA国家发改委领导致词Address, NDRC科学技术部领导致词Address, MOST工业和信息化部领导致词Address, MIIT高峰论坛Top Forum主持人：中国半导体行业协会集成电路设计分会秘书长??程晋格先生Moderator: Mr. Cheng Jinge, General Secretary, CSIA-ICCAD08:55-09:25主旨报告—???????中国半导体行业协会集成电路设计分会理事长??魏少军教授—???????Prof.?Wei Shaojun, General Director, CSIA-ICCAD09:25-09:55主旨报告—???????天津市科委09:55-10:20面向物联网、汽车电子、云计算的完整工艺平台—???????TSMC中国业务发展副总经理??罗镇球先生Technology Platform for Future Applications—???????Mr. Roger Luo, Vice President, Business Development, TSMC10:20-10:45“万物互联，质·量·为先”?－?物联网时代半导体企业的致胜关键—???????Mentor Graphics全球副总裁，亚太区总裁??彭启煌先生“Time to Quality and Quantity” – The Essence of Success in the IoT Era—???????Danny Perng, Corp. Vice President, PacRim Managing Director, Mentor Graphics10:45-11:10面向物联网的芯片设计平台即服务（SiPaaS）—???????芯原股份有限公司董事长，总裁兼首席执行官??戴伟民博士Silicon Platform as a Service (SiPaaS) for IoT—???????Dr. Wayne Dai,?Chairman, President and CEO, VeriSilicon Holdings Co., Ltd.11:10-11:35Cadence在新时代助您领先一步—???????Cadence公司全球副总裁，亚太区总裁??石丰瑜先生As Leader in Intelligence World with Cadence—???????Mr. Michael Shih, Corporate Vice President, Asia Pacific Region, Cadence Design Systems, Inc.11:35-12:00物联网：从芯片到软件的新要求—???????新思科技总裁兼联合首席执行官??陈志宽博士IoT: New Requirements?from Silicon to Software—???????Dr. Chi-Foon Chan,?President co-CEO,?Synopsys12:00-13:25自助午餐?Buffet Lunch主持人：?中国半导体行业协会IC设计分会第一副理事长??严晓浪教授Moderator: Prof. Yan Xiaolang, Chief Vice General Director, CSIA-ICCAD13:25-13:30幸运抽奖Lucky Draw13:30-13:55晶圆专工在物联网世界的角色—???????联华电子股份有限公司市场营销暨特殊制程研发副总经理??简山傑先生I.O.T. Foundry—???????Mr.?Chien,?Sha