玻璃化温度(tg)(Glass transition temperature (TG)).doc

玻璃化温度(tg)(Glass transition temperature (TG)).doc

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玻璃化温度(tg)(Glass transition temperature (TG))

玻璃化温度(tg)(Glass transition temperature (TG)) Introduction of raw material, material and parameters of PCB circuit board The PCB circuit board is introduced: according to the brand quality level from low to high 94HB94VO22FCEM-1CEM-3FR-4 divided as follows: The detailed parameters and uses are as follows: 94HB: ordinary board, not fireproof (most low grade material, die punching, cant make power board) 94V0: flame retardant cardboard (die punching) 22F: single sided semi glass fiber board (die punching) CEM-1: single-sided fiberglass board (must be drilled, not punched) CEM-3: double sided semi glass fiber board (except double sided cardboard) is the most low-end material of double sided board. Simple double sided board can be used with this material, 5~10 yuan / square meter will be cheaper than FR-4 FR-4: double sided glass fiber board Classification of flame retardant properties can be divided into four kinds of 94VOV-1V-294HB Prepreg: 1080=0.0712mm, 2116=0.1143mm, 7628=0.1778mm FR4 and CEM-3 are plates, FR4 is glass fiber board, and cem3 is composite substrate Halogen free refers to the base material that does not contain halogen (fluorine, bromine, iodine, etc.), because bromine will produce poisonous gas when burning, and environmental protection requirements. Tg is the glass transition temperature, that is, the melting point. The circuit board must be flammable and not burn at a certain temperature and can only be softened. The temperature point at this time is called the glass transition temperature (Tg point), which is related to the size and durability of the PCB board. What are the advantages of high Tg PCB boards and the use of high Tg PCB? High Tg printed circuit boards, when the temperature rises to a certain threshold, the substrate will change from glassy to rubbery, The temperature at this time is called the glass transition temperature (Tg) of the plate. That is to say, Tg is the highest temperature of the substrate to maintain rigidity (DEG C). Tha

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