晶体管的封装外形（Transistor package outline）.docVIP

晶体管的封装外形（Transistor package outline） Packaging outline of domestic transistors According to the standard provisions of domestic semiconductor transistors are ten shape and size, respectively represented by different letters and numbers. 1., metal packaging outline of the metal shell packaging transistors, mainly divided into B~G, six kinds of shape structure, various shapes and structures are divided into a variety of specifications. The B type packaging structure is mainly used for high frequency medium and small power transistors of silicon materials. It is divided into various specifications (see table 5-20), and the shape and pin arrangement are shown in figure 5-20. B type transistors, some models (such as 3DG56, 3DG80, etc.) for the four pin, it is more than three pins (emitter E, base B, collector C) transistor more than one ground terminal D. The C type packaging structure is mainly used for high and low frequency power transistors of germanium materials and switches for silicon materials. It is also divided into a variety of specifications. Table 5-21 is the outline dimensions and representative models of the C package transistor. Figure 5-21 is the outline and pin arrangement of the C type package transistor. D type package structure is divided into D-1 and D-2, table 5-22 is its size and representative model, figure 5-22 is its shape and pin arrangement. Transistors using E type packaging structure are 3DA86, 3DK10 and other models, and figure 5-23 is its shape, size and pin arrangement. F type packaging structure is mainly used for a variety of low-frequency high-power transistors, it is divided into F-0 type, ~F-4 type of five specifications, of which type F-2 packaging structure is the most widely used. Figure 5-24 is a F package transistor outline and pin arrangement, table 5-23 is the size of each size and representative models. G type package structure is divided into G-1~G-6 six specifications, the G-1 and G-2 pin line round pin line for flat G-3~G