电子元器件高速连续电镀设备及工艺介绍（Introduction of high speed continuous electroplating equipment and process for electronic components）.docVIP

下载本文档

4
0
约1.19万字
约 13页
2017-09-27 发布于河南
举报
版权申诉

电子元器件高速连续电镀设备及工艺介绍（Introduction of high speed continuous electroplating equipment and process for electronic components）.doc

1、原创力文档（book118）网站文档一经付费（服务费），不意味着购买了该文档的版权，仅供个人/单位学习、研究之用，不得用于商业用途，未经授权，严禁复制、发行、汇编、翻译或者网络传播等，侵权必究。。
2、本站所有内容均由合作方或网友上传，本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺！文档内容仅供研究参考，付费前请自行鉴别。如您付费，意味着您自己接受本站规则且自行承担风险，本站不退款、不进行额外附加服务；查看《如何避免下载的几个坑》。如果您已付费下载过本站文档，您可以点击这里二次下载。
3、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等，请点击“版权申诉”（推荐），也可以打举报电话：400-050-0827(电话支持时间：9:00-18:30)。
4、该文档为VIP文档，如果想要下载，成为VIP会员后，下载免费。
5、成为VIP后，下载本文档将扣除1次下载权益。下载后，不支持退款、换文档。如有疑问请联系我们。
6、成为VIP后，您将拥有八大权益，权益包括：VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
7、VIP文档为合作方或网友上传，每下载1次，网站将根据用户上传文档的质量评分、类型等，对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档

电子元器件高速连续电镀设备及工艺介绍（Introduction of high speed continuous electroplating equipment and process for electronic components）

电子元器件高速连续电镀设备及工艺介绍（Introduction of high speed continuous electroplating equipment and process for electronic components） Introduction of high speed continuous electroplating equipment and process for electronic components With the rapid development of information technology, the demand for electronic components has been increasing rapidly in recent years, and most of the components need to be plated. From the development of international electronic products, mainly in Japan and Europe and the United States in 70s, mainly the production of electronic components shifted to Singapore, Taiwan, Hongkong and other regions; however, after entering in 90s, the development focus gradually shifted to the mainland China, large quantities of foreign factories in China. They brought us a lot of markets and a lot of them Advanced production equipment and process. Therefore, the production process of domestic electronic component electroplating has rapidly moved closer to the international advanced technology level in recent years, and the most prominent one is the production of high-speed continuous electroplating automatic production line. Starting from the electroplating demand of electronic component products, this paper briefly introduces the characteristics, types and electroplating process conditions of high-speed continuous electroplating line. 2 electronic components electroplating characteristics and requirements 2.1, the plating parts are small in size and large in batch size, requiring low cost and high efficiency electroplating. 2.2, high coating requirements 2.2.1 electroplating components are generally functional coating, with its special weldability, conductivity and other requirements, the main types of plating are: Ag, Au, Sn / Pb, Ni and so on. 2.2.2 many components have strict requirements for their electroplating location and require partial plating. Such as SOT-23 semiconductor plastic lead frame, which requires partial silver plated width range of 1.1 + 0.1m