焊锡膏使用常见问题分析（Common problems analysis of solder paste）.docVIP

焊锡膏使用常见问题分析（Common problems analysis of solder paste） Common problems analysis of solder paste The welding is mainly reflow solder paste board level interconnect method is used in the SMT assembly process, the welding method to the needs of the welding characteristic of excellent combination of these features include easy processing, a variety of SMT designed with wide compatibility, high reliability and low cost welding; however, when welding is used as the most important elements of the SMT level and board level interconnection method in return, it has also been calling for further improving the welding performance of the challenge, in fact, the reflow soldering technology can withstand this challenge will determine whether to continue as the primary SMT solder welding materials, especially under the ultra fine pitch technology progress situation. Next, we will discuss several major issues that affect the improvement of reflow performance. We will briefly introduce each of these issues in order to stimulate the industry to develop new methods for solving this problem. Fixing of bottom element Double sided reflow soldering has been used for many years, the first on the first surface of the printed wiring, installation of components and soft melting, and then turned to the other side of the circuit board processing, in order to save more reasons, some process eliminates the need for the first soft melt, but also melt the top and bottom surfaces, typical example is the bottom surface of a circuit board with only small components, such as chip chip capacitors and resistors, the printed circuit board (PCB) design more and more complex, installed on the bottom surface of the element is also growing, the cohesive element shedding becomes an important issue. Obviously, element shedding phenomenon is due to lack of soft melting when the molten solder on the components of fixed vertical force, rather than a fixed vertical force can be attributed to the increase in the weigh