面对铜线挑战的劈刀解决方案.pdf

Capillary Solutions for Copper Wire Bonding Challenges Agenda Challenge - Capillary knowledge and challenges for Copper wire bonding  2nd bond related challenges  Pad Damage Challenge  Cap Wear  Cap Clogging  Process Fan-out Knowledge - process influence on capillary wear, clogging Knowledge  Gold vs. Copper Wire bonding Process  Wear shape related to Ball bond vs. Wedge Bond  By Wire type – Au vs. Bare Cu vs. Pd coated  By Process type – TC vs TS Solution  By lead frame type – PPF vs Silver plated  Clogging root cause fishbone Solution - Current capillary designs to meet copper challenges  KS ITA material  KS Granular morphology  E-CuPRA3G capillary design:  Based on life performance of CuPRA3G design  Lower USG  Better process portability RD Capabilities 2 - CONFIDENTIAL - Capillary Knowledge and Challenges for Copper Wire Bonding  Difference between X and Y Axis  Al Splash, Metal lift  Wear out at Capillary tip  Clogging  Process Fan-out 3 - CONFIDENTIAL3 - 2nd bond related challenges CHALLENGE  Improvements in bonder capabilities, capillary design, wire material and the bonding process have made the copper wire 2nd bond significantly easier to optimize and increases