机电一体化一董健-final参考资料 .doc

一种电容式硅微机械麦克风的设计与制造 董健 (浙江工业大学机械制造及自动化教育部重点实验室, 杭州, 310014) 摘要：文中给出了一种电容式硅微机械麦克风的设计和制造方法。微机械麦克风在单一硅片上制作，麦克风的两个电极由一个三层复合敏感膜和一个带有通气孔的金属铜底板构成。三层复合敏感膜采用低压化学气相淀积(LPCVD)工艺制作，中间一层是掺杂硼的多晶硅，上下两层是氮化硅，三层复合膜的厚度设计和制作工艺参数的选择使复合膜处于轻微的拉应力状态。底板采用低温电镀铜技术制作，底板上分布有许多圆形通气孔来调节敏感膜与底板间的空气压膜阻尼至临界阻尼。敏感膜与底板之间采用牺牲层技术形成空气间隙。测试结果表明，硅微机械麦克风在9偏置电压下的开环灵敏度为5.2，工作稳定最大电压为14，工作时频率带宽至少为 ，适合在工业界推广应用。 关键词：电容式硅微机械麦克风 三层复合敏感膜 铜底板 中图分类号：TP212 Design and Fabrication of a Condenser Silicon Micromachined Microphone DONG Jian (The?MOE?Key?Laboratory?of?Mechanical?Manufacture?and?Automation,Zhejiang?University?of?Technology, Hangzhou 310032, China) Abstract: This paper presents the design and fabrication of a condenser silicon micromachined microphone. Micromachined microphone is fabricated in a single-chip. Two electrodes of the microphone are formed by a sensing sandwich diaphragm and a perforated copper backplate. The sensing sandwich diaphragm is fabricated by LPCVD technology and consists of a layer of heavily doped polycrystalline silicon and two layers of silicon nitride. The choice of the thickness and fabrication process parameters of three layers of diaphragm makes diaphragm a slight tensile. The backplate is made using copper electroplating technology and perforated with circular holes. Perforated circular holes on backplate adjust air-gap damping between diaphragm and backplate to critical damping. A gap between diaphragm and backplate is formed by sacrificial technology. Measurement results show that the open-circuit sensitivity with 9bias voltage is 5.2, the pull-in voltage is 14, and the working frequency bandwidth is at least . Thereby, it has promising prospect in industrial field. Key words：condenser silicon micromachined microphone; sensing sandwich diaphragm; copper backplate. 前言* 采用微机械加工手段和微电子批量生产方式制作的硅微机械电容式麦克风具有体积小、成本低、高精度、可靠性高和批量制造等优点，因而具有较强的工业化应用前景。微机械电容式麦克风在工作时希望敏感膜具有较低的刚度并处于轻微的拉应力状态，底板则希望有较高的刚度，以此保证麦克风的开环灵敏度、频率带宽、工作稳定最大电压等主要技术性能指标，同时希望能采用简单的工艺制作，以适合工业化批量生产。从90年代初期开始，全世界上许多高校和研究机构