如何计算散热器的散热功率.docVIP

如何计算散热器的散热功率 Calculation Corner Estimating Parallel Plate-Fin Heat Sink Thermal ResistanceRobert E. Simons, Associate Editor, IBM Corporation As noted previously in this column, the trend of increasing electronic module power is making it more and more difficult to cool electronic packages with air. As a result there are an increasing number of applications that require the use of forced convection air-cooled heat sinks to control module temperature. An example of a widely used type of heat sink is the parallel plate configuration shown in Figure 1. Figure 1. Parallel plate fin heat sink configuration. ????? In order to select the appropriate heat sink, the thermal designer must first determine the maximum allowable heat sink thermal resistance. To do this it is necessary to know the maximum allowable module case temperature, Tcase, the module power dissipation, Pmod, and the thermal resistance at the module-to-heat sink interface, Rint. The maximum allowable temperature at the heat sink attachment surface, Tbase, is given by The maximum allowable heat sink resistance, Rmax, is then given by where Tair-in, is the temperature of the cooling air at the inlet to the? heat sink passages. At this point many thermal engineers will start looking at heat sink vendor catalogs (or more likely today start searching vendors on the internet) to find a heat sink that will fit in the allowable space and provide a heat sink thermal resistance, Rhs, less than Rmax at some specified flow rate. In some cases, it may be useful to do a sizing to estimate Rhs for various plate-fin heat sink designs to determine if a feasible design configuration is possible. The remainder of this article will provide the basic equations to do this. The thermal resistance of the heat sink is given by where h is the convective heat transfer coefficient, Abase is the exposed base surface area between fins, Nfin is the number of fins, fin is the fin efficiency, and Afin is the surface