第06章 组合电路.ppt

EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * EE141 * Note capacitance on the internal node – due to the source grain of the two fets in series and the overlap gate capacitances of the two fets in series EE141 * EE141 * Gate sizing should result in approximately equal worst case rise and fall times. Reason for difference in the last two delays is due to internal node capacitance of the pulldown stack. When A transitions, the pullup only has to charge CL; when A=1 and B transitions pullup have to charge up both CL and Cint. For high to low transitions (first three cases) delay depends on state of internal node. Worst case happens when internal node is charged up to VDD – VTn. Conclusions: Estimates of delay can be fairly complex – have to consider internal node capacitances and the data patterns. EE141 * Assumes Rp = Rn EE141 * For class lecture. Red sizing assuming Rp = Rn Follow short path first; note PMOS for C and B 4 rather than 3 – average in pull-up chain of three – (4+4+2)/3 = 3 Also note structure of pull-up and pull-down to minimize diffusion cap at output (e.g., single PMOS drain connected to output) Green for symmetric response and for performance (where Rn = 3 Rp) Sizing rules of thumb PMOS = 3 * NMOS 1 in series = 1 2 in series = 2 3 in series = 3 etc. EE141 * While output capacitance makes full swing transition (from VDD to 0), internal nodes only transition from VDD-VTn to GND C1, C2, C3 on the order of 0.85 fF for W/L of 0.5/0.25 NMOS and 0.375/0.25 PMOS CL of 3.2 fF with no output load (all diffusion capacitance – intrinsic capacitance of the gate its