硅片切割工艺讲义功课.pptVIP

硅片切割工艺讲义 制造二部 林青云 2006年3月 主要内容 1、车间流程的介绍 2、Squarer的介绍 3、Cropping Saw的介绍 4、Grinder的介绍 5、gluing Brick 的介绍 6、Wire Saw 7、Cleaning Station的介绍 1、车间流程的介绍 Building 1 Layout 2、SQUARER的介绍 3、Cropping Saw BAND SAW Slice usable length of brick by cropping top bottom Usable length of brick is determined by the Life time tester. Special diamond coated blade is used for cropping Blade rotates at constant speed. Mount the Brick Suitably on the Table Table moves at set speed to slice the brick SPECIFICATIONS BRICK PREPARATION Ingot is sliced into 16 pieces of 156x 156 x 220 mm size brick