光刻工艺中的焦距异常发生原因分析及解决办法研究.pdfVIP

目 录 摘 要····························································l Abstract·················································-··········3 第一章半导体光刻技术···············································5 第一节光刻工艺技术发展及展望····································5 第二节光刻基本原理及成像条件································““6 第三节光阻化学性质与作用····································“”6 第四节光刻工艺流程介绍··········································8 1．4．1去水烘烤／HMDS············································9 1．4．2光阻涂布··················································9