PolyMUMPs Process - MEMSCAP：PolyMUMPs过程MEMSCAP.ppt

August 31, 2004 Ron Wages Memscap - A publicly traded MEMS company A Case Study Introduction to PrototypingUsing PolyMUMPs Steve Wilcenski About MUMPs? The baseline process of the the MUMPs? program is the 3-layer polysilicon surface micromachining process (“polysurf”) known as PolyMUMPs The basic process includes 8* lithography levels, and 7 physical layers 2 mechanical and 1 electrical layer of polysilicon 2 sacrificial layers 1 electrical conduction 1 electrical isolation layer PolyMUMPs Process Seven Physical Layers Nitride Isolation between substrate and electrical surface layers Poly zero Electrical poly layer for ground plane or electrode formation. Below the first mechanical layer First oxide First sacrificial oxide layer, providing gap between poly1 and substrate/nitride Poly 1 First mechanical layer Second oxide Second sacrificial oxide layer, provides gap between second and first polysilicon Poly 2 Second mechanical layer Metal Provides electrical connection to package Eight Lithography Levels POLY ZERO Defines the polysilicon zero features ANCHOR 1 Opens points-of-contact between first polysilicon and substrate (nitride or poly 0) DIMPLE Generates bumps in under-surface of poly 1 to minimize stiction POLY 1 Defines first polysilicon features POLY1_POLY2_VIA Opens points-of-contact between first and second polysilicon ANCHOR 2 Opens points-of-contact between second polysilicon and substrate/nitride POLY 2 Defines second polysilicon features METAL Defines location of metal features Common Layout Terminology Layer a physical layer of material deposited during the fabrication process Always represented in mixed-case letters LEVEL a lithographic level used to pattern a physical layer. It may or may not correspond with a physical layer e.g. poly1= POLY1, but Second oxide is patterned by both ANCHOR2 and POLY1_POLY2_VIA Always represented in CAPITAL letters Common Layout Terminology Dimples small, shallow features in the underside of the lower polysil