风冷式CPU散热器的的设计毕业论文.docVIP

风冷式CPU散热器的设计 摘 要 I 伴随着电子工业的快速发展，CPU(Central Processing Unit)呈现出集成的晶体管数目急剧增加（从1990 年的2,300 个激增到现在的230,000,000 个）和芯片线宽急剧减小的趋势，导致CPU 功耗的增大和积聚的热量急剧增加，严重影响CPU 的正常工作。因此，提高CPU 散热片的散热性能已经成为电子制造领域中亟需解决的键问题之一。针对CPU 散热问题，本文在风冷式散热片的散热规律及结构优化两个方面开展了系统深入的研究。 在分析现有各种 CPU 散热片结构特点的基础上，利用ANSYS 的用户界面设计语言UIDL(User-Interface Design Language)，开发了CPU 散热片热分析软件和用户界面，并实现了与ANSYS 的集成。利用该软件，用户可方便、快捷地分析各种结构参数对CPU 散热片散热性能的影响规律。 散热片的优化过程实际上是一系列的前处理－求解－后处理－优化的循环过程。在满足散热空间约束的前提下，以使散热片中的最高温度值最小化为目标，对散热片结构参数进行优化设计，从而达到提升散热片散热性能的目的。实现的具体过程散热片热分析的基础上定义设计变量和目标函数、选择优化算法，在ANSYS 环境利用APDL(ANSYS Parametric Design Language)语言，开发热分析和优化控制功能程序，然后调用ANSYS 的优化模块实现散热片的结构参数优化。同时给出了一系列的 CPU 散热片热分析和结构参数优化实例，验证了本文提出的热分析和结构参数优化设计方法。最后，对全文进行了总结，并对后续的研究工作提出了一些建议。 关键词：散热片优化设计 ，APDL UIDL ，目标函数  Wind-cooled CPU heatsink design ABSTRACT II With the quickly development of electronics industry, the number of transistors integrated in CPU (Central Processing Unit) grows rapidly (from 2,300 in 1990 to 230,000,000 nowadays), and the line width of chip reduces rapidly. As a result, the power and the heat in CPU grow sharply, which results in that the function of CPU is impacted. Thus, the improvement of cooling performance of heat sinks becomes one of the key issues in electronic manufacture field. In this thesis, the cooling rules and structure optimization of air cooling system are studied deeply. After the structure characteristics of the existing CPU heat sinks are analyzed, CPU heat sinks analysis software and user interface are developed using UIDL (User-Interface Design Language) of ANSYS and integrated into ANSYS. By using this program, users can analyze the influence of various parameters to cooling performance of CPU heat sinks conveniently and quickly. The optimization process of heat sinks is a circular process of pre-solution, solving and post treatment. On the premise of satisfying the constraint of cooling space, the maximum temperat