纳米材料和纳米结构第七讲.pptVIP

第七讲 Physical Vapor Deposition 物理气相沉积 Physical Vapor Deposition (PVD) Definition Film deposition by condensation from vapor phase Three Steps of PVD Generating a vapor phase by evaporation or sublimation Electron-beam evaporation Molecular-beam epitaxy Thermal evaporation Sputtering Cathodic arc plasma deposition Pulsed laser deposition Transporting the material from the source to the substrate Formation of film by nucleation and diffusion Application Coatings of electronic materials Insulator Semiconductor Conductor Superconductor Nanometer scale multilayer structures Advanced electronic devices Abrasion resistant coatings Concerned Problems and Challenges Contamination at the interfaces or intermixing Multi-material systems involved Cost of equipment and maintenance Complexion of operation Systems Described in This Section Sputtering Pulsed laser deposition 1 Sputtering（溅射） 1-1 Principle of Sputtering 1-2 Sputtering System 1-3 Preparing Multilayer Structures by Sputtering 1-4 Current Status of Sputtering 1-1 Principle of Sputtering Ejection of Atoms from the Target Energetic particles bombarding a target surface with sufficient energy (50 eV ~ 1000 eV) Target Cathode, connected to a negative voltage supply Composed of the materials to be deposited Substrate Anode May be grounded, floated, or biased Glow Discharge Medium in Sputtering Chamber A gas or a mixture of different gases, most commonly Ar or He In reactive sputtering: introduce reactive gases such as O2 or N2 Pressure: a few mTorr to several hundreds mTorr Procedure Generation of positive ions: ionizing the sputtering gas by glow discharge Bombarding: accelerated positive ions to strike the target surface and remove mainly neutral atoms Condensation: neutral atoms leave the target and condense on the substrate surface, and form into thin films An Important Concept: Sputtering Yield A measurement of the efficiency of sputtering Ratio of the number of emitted particles to the nu