[理学]纳米第07讲-物理气相沉积法.docVIP

纳米材料和纳米结构  Physical Vapor Deposition 物理气相沉积 第七讲 Physical Vapor Deposition (PVD) 物理气相沉积 一、Definition定义 Film deposition by condensation(凝结) from vapor phase(气相) 从气相凝结的薄膜沉积 二、Three Steps of PVD： (PVD的三个步骤：) 1、Generating a vapor phase by evaporation or sublimation (用蒸发或升华生成一个气相) 1、Electron-beam evaporation(电子束蒸发) 2、Molecular-beam epitaxy(分子束外延) 3、Thermal evaporation(热蒸发) 4、Sputtering (溅射) 5、Cathodic arc plasma deposition(阴极电弧等离子沉积) 6、Pulsed laser deposition(脉冲激光沉积) 2、Transporting the material from the source to the substrate (把原材料导入基底；) 3、Formation of film by nucleation and diffusion(集结和扩散作用形成薄膜；) 三、Application(应用) 1、Coatings of electronic materials(电子材料的镀膜) Insulator绝缘体 Semiconductor半导体 Conductor导体 Superconductor(超导体) 2、Nanometer scale multilayer structures（纳米尺寸的层结构） Advanced electronic devices先进电子设备 Abrasion resistant coatings耐磨涂料  四、Concerned Problems(关注问题) *Contamination at the interfaces or intermixing(在物质界面和混合下的污染情况) * Multi-material systems involved(相关的复合材质系统；) * Cost of equipment and maintenance(器材和维护费用) * Complexion of operation(运算情况) 五、Systems Described in This Section(此节中描述的系统) Sputtering(溅射法) Pulsed laser deposition(脉冲激光沉积法) 1 Sputtering（溅射） 1-1 Principle of Sputtering(溅射原理) 1-2 Sputtering System(溅射系统) 1-3 Preparing Multilayer Structures by Sputtering(溅射法备制多分子层结构) 1-4 Current Status of Sputtering(溅射法的近况) 1-1 Principle of Sputtering(溅射原理) 1、Ejection of Atoms from the Target（靶物质原子的喷溅） * Accomplished by an energetic particle bombarding a target surface with sufficient energy (50 eV – 1 000 eV) （在足够电压下（大概50---1000eV）,高能量粒子撞击靶物质表面来完成喷溅。） 2、Target（靶物质） * Cathode, connected to a negative voltage supply（阴极连接到电压负极；） * Composed of the materials to be deposited（堆积组成的材料） 3、Substrate（基底材料） * Anode（阳极） * May be grounded, floated, or biased（可能是接地、漂浮或偏移） 4、Glow Discharge Medium in Sputtering Chamber（溅射室的散热介质） * A gas or a mixture of different gases,