半导体研究2.pdf

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半导体研究2

VACT’s Rotatable Sputtering Technology e m a n e l i f / 5 0 0 2 , 3 2 e n u J 1 COMPANY CONFIDENTIAL Outline 1 Key Requirements for a Modern Magnetron 2 Key Features of VACT’s C-MAG® Cathode 1 Proprietary VAC-MAGTM Endblock 2 X-Bar Magnet Array – Best in the Industry 3 Install Base 4 Conclusions e m a n e l i f / 5 0 0 2 , 3 2 e n u J 2 COMPANY CONFIDENTIAL Key Requirements for a Modern Magnetron • Designed from first principles for high current AC operation • Robust mechanical and vacuum design • Target materials utilization 75% • Deposition Uniformity 4% thickness range • Minimization of arc and debris generation • Self-maintenance by users e m a n e l i f / 5 High Uniformity - Long service life – 0 0 2 , 3 2 e Low cost of ownership n u J 3 COMPANY CONFIDENTIAL KEY FEATURES of VACT’s C-MAG® Cathode End blocks: Up to 400 amps DC or AC Up to 1,100 V DC and 2,500 V AC Magnet Bar: Magnet Bar Array: Robust, tunable, insoluble/water cooled magnetic material Optimally positioned for sputtering of the entire target surface Magnet Bar Turn-Around: e Suppress uneven erosion at turn-arounds m a n e l Quick change one-piece turn-around i f / 5 0 0 2 3, Targets: 2 e n u Non-proprietary fixation allows choice of target su

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