Ni-SiC复合镀层电结晶初期动力学分析-中国有色金属学报.PDFVIP

第 18 卷第 5 期 中国有色金属学报 2008 年 5 月 Vol.18 No.5 The Chinese Journal of Nonferrous Metals May 2008 文章编号：1004-0609(2008)05-0823-06 Ni-SiC 复合镀层电结晶初期动力学分析 赵旭山，谭澄宇，陈文敬，刘 宇，李劲风，郑子樵 ( 中南大学 材料科学与工程学院，长沙 410083) 摘 要：利用循环伏安方法和恒电位阶跃技术研究 Ni-SiC 复合镀层电沉积行为。结果表明：Ni-SiC 复合镀层和 纯 Ni 镀层的形核/生长过程符合 Scharifker-Hill 三维成核模型；在低过电位下，Ni-SiC 复合镀层形核/生长过程按 三维连续成核机制；高过电位下，形核/生长过程遵循瞬时成核机制，与纯Ni 镀层的形核/生长过程具有一致性； 无论 Ni-SiC 复合镀层还是纯Ni 镀层，形核弛豫时间 tm 随负电位的增大呈现有规律递减趋势，相应的Im 值基本相 近；SiC 粉体的引入导致 Ni 形核的过电位正移和 tm 的显著减小。 关键词：电结晶；形核；循环伏安；恒电位阶跃 中图分类号：TG 172.82 ；TG 174.44 文献标识码：A Nucleation kinetics analysis of Ni-SiC composite film during early electrocrystallization processes ZHAO Xu-shan, TAN Cheng-yu, CHEN Wen-jing, LIU Yu, LI Jin-feng, ZHENG Zi-qiao (School of Materials Science and Engineering, Central South University, Changsha 410083, China) Abstract: The electroplating behavior of fabricating Ni-SiC composite film (NS) was investigated using chronoamperometry method in conjunction with the cyclic voltammetry method. The results show that, in the case of lower electroplating negative voltage, the co-deposition of Ni-SiC film follows a 3-D progressive nucleation/growth mechanism. While in the case of higher electroplating negative voltage, it follows a 3-D instantaneous nucleation/growth mechanism. However, either Ni-SiC co-deposition coatings or pure Ni coatings, the nucleation relaxation time tm decreases regularly with the increase of the negative potential, while the corresponding current Im are almost in the same quantity. Obviously, because of addition of SiC powder, the nucleation