英文确认范例.ppt

防焊字體過粗造成模糊 The text width is above normal in cause that be blurred. 防焊字體過小辨識不易 It is difficult to recognize after exposing if mask texts are undersized. 折斷邊光學點防焊未打開 Fiducials are covered by solder resist on the break-away. 焊墊防焊未開會上漆異常 There is a peculiar condition that SMD pad is closed on mask layer. (it will be covered by S/R) 按鍵焊盤一般防焊設計為開窗, 請確認下墨是否為刻意設計? As usual, the solder opening is full of key pad, please confirm that whether the solder dam within key pad is your intended design. 如圖示部份看似多餘的防焊開口是否為刻意設計? The mask pad as figure indicated seems unnecessarily, please confirm that whether it is your intended design or not. 零件區域辨識符號開在基材上, 可辨識效果不明顯請確認是否沒關係? The poor readable effect resulted from the corner mark is placed on substrate, please confirm that is OK or not. 零件區域辨識符號開在線路上, 造成露線情形 The corner mark is overlapped with trace and therefore result in trace exposed. 粗線路上之BGA pad上件面積會比一般獨立pad多出防焊打開部份, 錫膏量不同且變形是否會產生上件問題 The square measure of tracking by BGA pad within the thicker trace differs from the square measure of detached BGA pad in increasing, whether the different paste volume out of shape might cause poor wetting problem for SMT processing or not. BGA pad間距過小無法下墨 The spacing between BGA pads is quite narrow couldn’t apply the solder dam on it. 非組件面(bottom side)防焊字體為字正設計 Mask texts as figure indicated are non-mirrored on the bottom mask layer. 板內客戶料號錯誤 Wrong part number is appeared on the (top or bottom) mask layer. 原稿防焊無隔離環設計曝光製作上有困難 The exact accuracy is difficult for exposure processing if the mask pad was without clearance in design. 防焊外形邊框較粗是否需保留使該邊框露底材 The frame width is thicker inside the board on mask layer, whether it needs to be remained to clear the solder resist or not. 焊件框部份在基材上部份在銅面上是否為刻意設計 The solder opening with shielding case is partially on substrate partially on copper plane, whether it is your intended design or not. Silkscreen layer 文字過細網板無法印出(圖1) The legend width is below accep