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毕业设计(论文)-基于单片机的工业电阻炉智能温度控制系统设计精选.doc

毕业设计(论文)-基于单片机的工业电阻炉智能温度控制系统设计精选.doc

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毕业设计(论文)-基于单片机的工业电阻炉智能温度控制系统设计精选

XXX大学 本科生毕业设计说明书(毕业论文) 题 目:基于单片机的工业电阻炉 智能温度控制系统设计 学生姓名:XXX 学 号:08XX 专 业:XX 班 级:XX 指导教师:XX 讲师 基于单片机的工业电阻炉智能温度控制系统设计 摘要 电阻炉是电流过电阻体产生热量来加热或熔化物料的一电炉。电阻炉在化工、冶金等行业因此温度控制在科学研究工业生产中具有重要意义。 信号放大temperature control intelligent system of industry resistance furnace design based on SCM Abstract Resistance furnace can produce heat to melting materials flowing through the resistor body by the current. Resistance furnace widely used in chemical industry, metallurgy industry, etc. Its temperature control requirements is very high, the temperature control will have a direct impact on the product quality and production efficiency, therefore resistance furnace temperature control has an important meaning in scientific research and industrial production. This design uses the single chip microcomputer as the data processing and control unit, the resistance furnace as control object; the thermocouples used as measuring element, SCR as the output control elements to achieve resistance furnace temperature automatic control. The system uses K thermocouple temperature sensor type; it sent the examination of the resistance furnace temperature signal into MAX6675 chip, through a series of amplification after conversion, therefore send a signal to STC89C52 microcontroller within the PID operation, but also regulation PID parameters through the keyboard. After the PID operation, sent the signal of control output, and shows temperature through LED display at the same time, and remains the temperature of resistance furnace in set range. This design according to the needs of the system, design the hardware circuit and detailed introduces the hardware circuit of each part; this design write software program according to each part of the software flow chart. Key words:The resistance furnace; MAX6675; Single-chip microcomputer; PID control 摘要 I Abstract II 第一章 绪论 1 1.1 课题研究的背景及意义 1 1.2 电阻炉的应用与发展 2 第二章 系统总体设计方案 4 2.1设计总体思路 4 2.2 系统技术指标 4 2.3 设计方案选择 4 2.4系统总体设计方案 5 第三章 系统硬件设计 7 3.1温度检测部分

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