[信息与通信]高级IC封装技术EPAC_Introduction.pdfVIP

Introduction to Advanced Electronic Packaging Technologies Shi-Wei Ricky Lee Electronic Packaging Laboratory Department of Mechanical Engineering Hong Kong University of Science Technology Clear Water Bay, Kowloon, Hong Kong Tel: +852-2358-7203, Fax: +852-2358-1543 E-mail: rickylee@ust.hk Homepage: http://www-mech.ust.hk/~rickylee 16/5/2001 Outline of Presentation ÿElectronic Packaging – An Overview ÿClassifications of Electronic Packaging ÿChip-level Packaging ÿBoard –l