cu 20wt.%sn包晶合金定向凝固组织演化规律word格式论文.docxVIP

摘要本文以 Cu-20wt.%Sn 包晶合金为研究对象，在 1μm/s~15μm/s 速度范围内 开展定向凝固试验，通过光学金相和背散射等手段，研究了试样从初始过渡到 两相稳定生长过程中凝固组织的演化规律。对抽拉速度为 10μm/s 的试样进行了 淬火前的保温试验，研究包晶反应机理，重点考察了合金在包晶凝固过程中溶 质传输机制。测量了不同速度包晶层的厚度，与包晶反应不同阶段生成包晶相 的理论值进行对比，分析包晶相的生长机理。随着生长速度的增加，初生 α 相的形态经历了粗胞状、细胞状、胞枝状再 到树枝状的转变；初始过渡区长度逐渐变小，组织随生长速度增加经历了由单 相到两相的变化。低速试样(v2.5μm/s)中出现了带状组织和岛屿带状与 α/β 共 生生长相互交替的震荡组织，不同生长条件下，带状组织和 α/β 耦合的类共生 生长组织之间可以转化。保温试样糊状区溶质均匀化得到单相区的时间与 TGZM 理论计算结果符合，与溶质原子纯扩散理论的计算结果差别较大，由此推测负载溶质完成溶质传 输的主要方式是液滴，而不是原子扩散。保温时间对包晶层的厚度的影响满足 St.John 和 Hogan 给出的理论模型，经过拟合，包晶层厚度与保温时间之间满足Δx = 1.49 t测量了随速度变化的包晶层厚度，用 St.John 和 Hogan 的包晶层厚度计算 模型，分析了包晶反应和包晶转变阶段包晶层的厚度，与实测数据对比，判断包 晶生长的主要机理为包晶转变。关键词 Cu-20wt.%Sn；包晶合金；定向凝固；包晶反应；组织AbstractDirectionally solidified experiments were conducted for Cu-20wt.%Sn peritectic alloy in a growth rate range from 1μm/s to 15μm/s. The solidification structure evolution was investigated from initial transient to steady-state solidication by optical metallographic and XRD. Temperature-stabilization experiments before quenching were carried out to study the kinetics of peritectic reaction and the solute conduction theory during peritectic reaction on the growth rate of 10μm/s. The variation of thickness of peritectic phase was measured and compared with theoretical value in different periods during peritectic reaction; the growth mechanism of peritectic reaction was analysised.With the increase of growth rate, the morphology of solid-liquid interface changes from coarse and shallow cells, fine and deep cells, to cellular dendrite and dendrite,and the length of initial zone became short. The morphology changed from single phase into dual phase with the increase of growth rate. Banded structure and α/β coupled growth altenating with each other can be observed in low growth rate samples(v2.5μm/s) and banded structure and α/β coupled growth can alternatewith each other under different growth conditions.The time that the temperature-stabilization samples need to reach the solute homogenization in the mushy zone were