基于树脂系基板的埋置式pcb可制造性与可靠性技术分析-manufacturability and reliability analysis of embedded pcb based on resin substrate.docxVIP

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基于树脂系基板的埋置式pcb可制造性与可靠性技术分析-manufacturability and reliability analysis of embedded pcb based on resin substrate.docx

基于树脂系基板的埋置式pcb可制造性与可靠性技术分析-manufacturability and reliability analysis of embedded pcb based on resin substrate

representthatthedeformationofmarginaltypeembeddedcapacitorislowerthancentraltype.Sotheprocessreliabilityofmarginaltypeishigherthancentraltype.Thentheresidualstressfieldofprocesssimulationistheinitialstressfieldofthesubsequentfiniteelementanalysis.Thereliabilityofembeddedcapacitorisstudiedbycouplingresidualstresswithacceleratedthermalcycling.Bycomparingtoexperimentalresults,thesimulationresultsshowthatthemicro-viainthelateralsubstratehasbeenobviousdeformed,andthestressconcentrationisfoundinthemicro-vias,whichwillresultinsignalintegrityproblemsandotherreliabilityproblems.Inthesubsequentuncouplin

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基于树脂系基板的埋置式pcb可制造性与可靠性技术分析-manufacturability and reliability analysis of embedded pcb based on resin substrate.docxVIP