Impurity and alloying effects on interfacial reaction layers in Pb-free soldering-T.Laurila 2010重要.pdf

Materials Science and Engineering R 68 (2010) 1–38 Contents lists available at ScienceDirect Materials Science and Engineering R journal homepage: www.el /locate/mser Impurity and alloying effects on interfacial reaction layers in Pb-free soldering * ¨ T. Laurila , V. Vuorinen, M. Paulasto-Krockel Electronics Integration and Reliability, Helsinki University of Technology, P.O. Box 3340, FIN-02015 TKK Espoo, Finland A R T I C L E I N F O A B S T R A C T Article history: The objective of this review is to study the effect of minor alloying and impurity elements, typically Available online 6 January 2010 present in electronics manufacturing environment, on the interfacial reactions between Sn and Cu, which is the base system for Pb-free soldering. Especially, the reasons leading to the observed interfacial Keywords: reaction layers and their microstructural evolution are analysed. The following conclusions have been Lead-free solders reached. Alloying and impurity elements can have three major effects on the reactions between the Sn- Intermetallic compound layers based solder and the conductor metal: Firstly, they can increase or decrease the reaction/growth rate. Thermodynamics Secondly, additives can change the physical properties of the phases formed (in the case of Cu and Sn,