各种表面处理的无铅焊接润湿性测试PCB finish wetting balance test.ppt

Wettability testing of copper based surface finishes for lead free assembly/各表面處理的無鉛焊接焊錫性測試 Information provide by Atotech/ 資料由Atotech提供 2006.3.2 Training principle/培訓原則 No advertisement/拒絕做廣告 Focus on experimental methodology and conclusions/注重于實驗方法和結論 With the aim of learning and self-improvement/本著學習和自我提升的思想 On the basis of discussion and communication/立足于交流與討論 A few notes /几點說明 This is a genuine piracy/ 本報告純屬盜版 Feel free to ask/ 有問題盡管問 Prepare for my questions/ 請准備解答我的問題 Correct any existing mistake/ 糾正所有存在的錯誤 The accuracy of the data is reserved/ 本人不負責數据的准确性 Content/內容 General introduction/簡介 Reflow profiles/回流焊溫度曲線 Wettability testing methods/潤濕性測試與方法 Discussion/討論 Conclusion/結論 What’s different in lead free soldering?/無鉛焊接到底不同在哪里? Peak temperature is higher/最高焊接溫度更高了 Time above liquidus is longer/ 焊料在熔化狀態下的時間更長了 Solder composition is different/焊料的成份有變化 What does it mean?/無鉛焊接意味著什么? Higher temperature/longer times/different solder alloy/更高的焊接溫度/更長的熔錫時間/焊料合金成份的變化 Stronger oxidation of solder paste and surface finish/焊膏和表面處理的氧化更嚴重 Thickness of IMC increased/合金層厚度更厚 Metallurgy of solder joints is different/焊接點金屬特性的變化 No long term production experience/沒有長期的量產經驗 Reflow equipment/回流焊設備 Reflow equipment for investigations/用于研究的回流焊設備 Used reflow profile for subsequent aging and soldering/ 后續的老化實驗和焊接的溫度曲線 Eutectic tin lead/錫鉛合金 Sn/Pb/錫鉛比 63/37/ Copper based final finishes, investigated layers 研究的各种表面處理層 Wettability testing/潤濕性測試 Comparison of/對比性測試項目 Wetting balance/潤濕平衡性測試 Solder spread/錫料延伸性測試 Mis-print test/絲印錯位測試 De-wetting/縮錫測試 Varying/可變因素 Solder flux/ 不同的助焊劑 Solder alloys/eutectic tin-lead vs. lead-free/ 不同的焊料—錫鉛焊料與無鉛焊料 Soldering atmosphere/ air vs. N2 /在空气中焊接與在氮氣保護下焊接 Wetting balance潤濕平衡測試/Metronelec ST60(設備名稱) Operator independent test method/采用無人員差异性的方法 Wetting balance -- tested solder fluxes/潤濕平衡測試--測試用的助焊劑种類 Using solder pot with SnAg3.5Cu0.7 alloy/錫爐采用SnAg3.5Cu0.7的合金 260oC Air atmosphere/空气中測試 Wetting balance test -- Wetting force/潤濕平衡測試—潤濕力測試 SnAg3.