研磨抛光液对CMP研磨抛光艺的影响毕业设计(论文).docVIP

毕业设计（论文）报告 题 目 研磨抛光液对CMP研磨抛光工艺的影响 2013年 4 月 研磨抛光液对CMP研磨抛光工艺的影响 摘要：半导体科学在现代科学技术中占有极其重要的地位。它广泛应用于国民经济的各个领域中，它的发展推动着人类社会的进步和物质文化生活水平的提高，由其兴起的半导体产业越来越受到各国的重视，自20世纪以来取得了长足的发展。本文主要采用了文献研究法和调查法，通过查找互联网和书籍文献，及在从事半导体产业的工厂中的实习，获得了大量的资料。本文主要研究半导体产业的相关知识，说明半导体产业在国内国外目前的发展历史并讨论半导体产业的发展应用。随着半导体技术愈加精细化，晶圆尺寸由6英寸（150mm），8英寸（200mm），12英寸（300mm），甚至未来的18英寸（450mm）从而越来越大，在半导体领域中化学机械抛光(CMP)占有着越来越重要的作用，本文在分析CMP工艺的基础上，及初步了解与分析了CMP半导体晶片过程中抛光液的重要作用，总结了抛光液的组成及其化学性能(氧化剂、磨料及pH值等)和物理性能(流速、粘性及温度)对抛光效果的影响规律。本文是在前人研究的基础上，进行深入了解，希望从而对半导体产业向前发展起到一定的积极作用。 关键词：半导体，化学机械抛光，抛光液 Grinding and polishing liquids influence on the CMP polishing process Abstract：Semiconductor science occupies an extremely important position in modern science and technology. It is widely used in various fields of national economy, its development promotes the progress of human society and the improvement of material and cultural life, by the rise of the semiconductor industry is more and more brought to the attention of the countries, since the 20th century has been a rapid development. This paper mainly adopts literature research and survey method, literature through search the Internet and books, and practice in factory is engaged in the semiconductor industry, won a huge mass of data. In this paper, we study relevant knowledge of the semiconductor industry, the development history of semiconductor industry at home and abroad at present and discuss the development and application of semiconductor industry. With increasingly sophisticated semiconductor technology, Wafer size from 6 inches (150 mm), 8 inches (200 mm), 12 inches (300 mm), and even the future of 18 inches (450 mm) and so more and more big ，in the field of the semiconductor chemical mechanical polishing (CMP) plays a more important role in the future, in this paper, based on the analysis of the CMP process, and preliminary understanding and analysis of the CMP polishing fluid is important role in the process of semiconductor chips, summarized the compo