BGA双球（枕头效应）原因分析及改善对策BGA soldering-Head in pillow.pptVIP

BGA Soldering-Head In Pillow In-situ observation of BGA soldering Classification of BGA soldering failure mode Case study for BGA soldering Outline 1-1 Observation of BGA soldering gap change In-situ observation of BGA soldering Peak Temp. Cooling down PKG PCB Solder sphere Solder paste Flux clean tin oxide Solder ball paste melt at melting point Thicker oxide and weaker flux activity caused non-melting During peak cooling Non-melting caused head in pillow Reflow Profile of Process Classification of BGA soldering failure mode a. Void b. Bridge d. Crack e. Head-in-Pillow f. Non-wetting c. Missing ball g. de-wetting h. shift i. solder ball Head-in-pillow heating heating cooling Peak Temp BGA assembly problem analysis BGA problem Component (84.8%) PCB (6.1%) Solder paste (3.0%) SMT process (6.1%) BGA ball pollution (45%) Pad pollution (18.2%) others (9.1%) warpage (12.1%) Profile (3.0%) Pick place (3.0%) Weak activity (3.0%) warpage (3.0%) PAD pollution (3.0%) Void Reflow PCB substrate BGA ball Paste Flux Powder size alloy composition Activator Viscosity Oxidation contamination Cleanness shelf life Surface finish Design of pad Oxidation of pad Degauss timing Bridge Process Substrate Solder Flux Bending Miss mounting Slump Dewetting PCB substrate BGA ball Paste Flux Alloy composition Oxidation contamination Cleanness shelf life Surface finish Oxidation of pad Activator Crack PCB substrate Solder Reflow condition Alloy composition Design Bending Pillow Assembly Device Solder Ball Substrate Surface issue Shape Issue Composition design Split Surface oxidation Residue of flux Contamination Co-planarity Ball size design Bending Substrate (PCB) Paste Reflow Mounting Bending Alloy composition design Printing Tackiness decay Height or volume insufficient Flux activator efficiency Heat insufficient Over-preheat Flux activator decay Oxidation of BGA ball Half-melting or non-melting Picking Precision BGA Case Study BGA Head-in-pillow defect issue Head-in-pillow cross-s