1-s2.0-S0167931717300540-main-外文参考资料.pdfVIP

Microelectronic Engineering 172 (2017) 8–12 Contents lists available at ScienceDirect Microelectronic Engineering journal homepage: /locate/mee Research paper Influence of additives on Cu thin films electrodeposited directly on Ti diffusion barrier in Cl−-free electrolytes for Cu interconnect Byoungyong Im, Sunjung Kim ⁎ School of Materials Science