无铅生产原则the no lead manufacturing initiative.pdfVIP

The No Lead manufacturing Initiative The No Lead manufacturing Initiative Dr. Srinivas T. Rao UCLA Workshop on Lead-free Solder for Electronic, Optical, and MEMs Packaging and Manufacturing September 5th 2002 Address Mfg. Needs of OEMs and EMSs Address Mfg. Needs of OEMs and EMSs • Monitor environmental legislation and adjust activities if necessary • Recommend an ‘industry standard’ lead-free alloy (reflow and wave) • Develop criteria for industry to use to evaluate Pb-free processes • Share information in a timely manner to promote common path to Pb-free • Develop “best practices” experimental procedures to measure mechanical, thermal, electrical and wetting properties of Pb-free solders • Develop solder databases for properties and literature references for lead-free alloys in the public domain • Promote modeling for reliability through generation of best possible data and modeling methods • Work with component and PCB suppliers to develop specifications to meet higher temperature reflow conditions Connect with and Strengthen Your Supply Chain Connect with and Strengthen Your Supply Chain North America Electronics Goal North America Electronics Goal N. American OEM’s/EMS’ need to prepare processes to be able to deliver Pb-free products in 2001 with an ‘eye’ to total Pb-elimination by 2004. – Japan driving “Green”consumer products. !Timetables seem to be holding (2001-2003) – NEMI companies received serious inquiries. – EU legislation banning lead in electronics in 2004, proposal pushed out to 2007. !Individual Countries can shorten timeframe. NEMI engaged the technical side of Pb-free related to compatibility with existing assembly infrastructure. Connect wi