半导体制程学习资料+教学课件.ppt

? PHOTO (黄光) ? 制程 设备 ? ETCH (蚀刻) ?制程 设备 ? Thin-Film (薄膜)--CVD ?制程 设备 ? Thin-Film (薄膜)--PVD ?制程 设备 ? CMP (化学机械研磨) ?制程 设备 ? Diffusion (扩散) ?制程 设备 ? WET (酸槽) ?制程 设备 ? Implant (离子植入) ?制程 设备 ? Integration (制程整合) ? Manufacture (制造部) 半导体制造工程 Brief Process Flow - Isolation P-sub (Silicon wafer) SiN (Nitride) Pad oxide 1.1. Wafer Start 1.2. PAD Oxidation 110A (stress buffer) 1.7. SiN (Nitride) Deposition 1.5KA 1.8. Diffusion Lithography : 1.8.1 P.R. coating 1.8.2 Stepper Exposure 1.8.3 Development Photo Resistor coating Diffusion mask Stepper Exposure Diffusion P.R. P-sub (Silicon wafer) SiN (Nitride) Pad oxide Diffusion P.R. P-sub (Silicon wafer) SiN (Nitride) Pad oxide STI STI Brief Process Flow – Isolation (Cont) 1.7. Trench (STI) Plasma Etching 1.7.1 SiN Etching 1.7.2 Silicon Etching 1.8. Photo Resistor remove SEM (Scanning Electronic Microscope) Brief Process Flow – Isolation (Cont) 1.7. APCVD STI refill 1.7.1 Liner Oxide Growth 1.7.2 APCVD Oxide deposition 1.7.3 STI Furnace 1000C Densify 1.8. STI CMP (Chemical-Mechanical Polish) 1.9. SiN remove Diffusion P.R. P-sub (Silicon wafer) SiN (Nitrid) Pad oxide STI STI STI N-WELL Mask Brief Process Flow - Well formation P.R. Coating N-WELL P.R. Stepper Exposure 2.1 N-WELL Formation : 2.1.1 N-WELL PR coating 2.1.2 N-WELL Lithography 2.1.3 Development 2.1.4 N-WELL implant 2.1.5 PR stripping 2.2 P-WELL Formation : 2.2.1 P-WELL PR coating 2.2.2 P-WELL Lithography 2.2.3 Development 2.2.4 P-WELL implant 2.2.5 PR stripping P-sub(Silicon) Sac. oxide STI PWELL N-WELL P.R. Coating P-WELL Mask Stepper Exposure N-WELL Implant 1. N-WELL- 1 2. N-WELL- 2 7. P MOS - VT 8. P MOS anti-punch P-WELL Implant 1. P-WELL- 1 2. P-WELL- 2 7. N MOS - VT 8. N MOS anti-punch Brief Process Flow - Gate Oxide and POLY PR coating P-sub (Silicon) NWELL PWELL Gate Oxide TG Mask Stepper Exposure Gate Oxide 2 UPOLY growth 3 Gate Oxide Formation : 3.1 Thick Gate Oxide Growth 3.2 PR coating 3.3 TG Lithography 3.4 Developme