高温干燥环境中烧结纳米银的电化学迁移可靠性研究-材料加工工程专业论文.docxVIP

ABSTRACT With the development of wide band-gap semiconductors, low-temperature joining of semiconductor chips by the sintering of silver paste, a novel green packaging material, is emerging as an alternative solution for die-attaching power electronic device, especially for high-temperature applications. This paper mainly studied the reliability of nanosilver paste in high power electronics applications at high temperatures to find ways to increase the reliability of nanosilver paste in high power electronics applications at high temperatures. In this paper, we studied the formation of silver bridges during electrochemical migration of sintered nanosilver ， we find that silver dendrites formed during electrochemical migration of sintered nanosilver grow from cathode toward anode. We observed the microstructure of silver bridges and found that the migrating silver bridges were presented as discrete silver particles on the surface of alumina substrate. The discrete silver particles preferentially emerged at the boundaries of the alumina particles at the initial stage. We proposed possible mechanism of electrochemical migration. Oxygen may play an important role in the migration of sintered nanosilver at high temperatures in our speculated mechanism. We defined the “lifetime” of electrochemical migration of sintered nanosilver, which is the time at which the leakage current first reaches 1 mA. We studied the different effects of temperature, DC bias, electrode spacing, electrode types and substrates on electrochemical migration of sintered nanosilver. We find that the “lifetime” of electrochemical migration increase with the dc bias decreasing, electrode distance increasing, and temperature decreasing. The “lifetime” of electrochemical migration of sintered nanosilver on alumina nitride substrate is longer than that on the alumina substrate. Based on the Arrhenius equation, we proposed a prediction model of the “lifetime” of electrochemical migration and prop