SMT资料ProfileGuidelines英文.ppt

Http://www.HTKSMT.com Profile Guidelines /sundae_meng Initial Heating Ramp Initial Heating Ramp Object is to get profile to pre-heat stage Limited by board components (thermal shock) Explosive out-gassing from the solder paste will only occur under extreme conditions (eg laser soldering) Common ramp-rates are 1-3°C.s-1 This stays the same for lead free Pre-heat Soak Pre-Heat Soak The pre-heat allows all areas of the board to reach a similar temperature before reflow With modern ovens it is possible to reduce or eliminate the “plateau” part of the profile There is no specific activation tempe